Director's Profile


Dr G Takyi 

Name: Dr. Gabriel Takyi

Position: Director, The Brew-Hammond Energy Centre,

Senior Lecturer, Department of Mechanical Engineering

Kwame Nkrumah University of Science & Technology

Kumasi, Ghana

E mail: gabrieltakyi@yahoo.co.uk, gtakyi.soe@knust.edu.gh

 

 

BRIEF PROFILE:

Dr. Gabriel Takyi is a Senior lecturer in Materials and Production Engineering at the Department of Mechanical Engineering, Kwame Nkrumah University of Science & Technology (KNUST). Prior to this, he was as a Senior Development Engineer at JDS Uniphase, Plymouth, UK where he was involved in the characterization and assembly of 980 and 1440 nm pump laser devices used in the optoelectronics industry. He is currently involved in research work on various aspects of surface mount technology (SMT) related issues, focusing more on the solder joint integrity of electronics manufacturing and assembly products. His main research interests are in renewable energy systems and electronics manufacturing and assembly processes. He is currently the Principal Investigator of USAID, PEER Science Project on the Reliability and Performance Evaluation of Solar Photo voltaic (PV) Modules due to solder joint degradation and other effects in Sub-Sahara Africa region. He was the Head of Mechanical Engineering Department, KNUST and currently the Director of The Energy Centre.            

EDUCATION:

1995-1999: Postgraduate Research leading to PhD in Electronics Manufacturing & Assembly

(Plasma cleaning of electronic components for fluxless soldering), University of Salford,

Manchester, UK in collaboration with Nortel Networks, Harlow, Essex, UK).

1994-1995 University of Salford, Manchester, UK: MSc Advanced Manufacturing Technology

1990-1994 University of Salford, UK. BEng. (Hons) Degree Manufacturing Engineering

(Second Class Upper Division; 2:1)

PROFESSIONAL EXPERIENCE:

1995-1999 Research Engineer: Nortel R&D Site, Harlow, Essex UK. RF Plasma cleaning of PCB and surface mount devices for fluxless soldering. Optimisation of the plasma cleaning process (gas system selection)

Jan -May 2000 Process Engineer: PAC International, Bredbury, Stockport  (High volume            
Manufacturer of Integrated Access Control and Alarm Communication Systems). Lamination of smart cards

2000-2002 Product Design & Development Engineer: JDS Uniphase, Optoelectronics
Packaging, Plymouth (Manufacturer of Pump Lasers). Solder joint characterization (piece parts
includes: thermal-electric cooler,(TEC/heat pump), laser diode, submount etc.), thermal challenge
(measurements of Itec, Vtec and output power)

June 2002-May 2004: Plasma Etching Consultant (Microwave & RF Plasma Systems)

April 2004-2006: Lecturer: System Analysis & Design, Internet System Development, E-
Commerce, Computer fundamentals, Principles of programming, Queens Park College, London, E1
2LH.

December 2006-To date: Senior Lecturer:  Department of Mechanical Engineering, Kwame Nkrumah University of Science and Technology, Kumasi, Ghana. 

1st February 2012-2016 Academic Board Representative (Faculty of Automobile Engineering, Ho Polytechnic)

August 2014-July 2015 Head of Department- Mechanical Engineering Department, KNUST, Kumasi.

August 2015- Date Director, The Energy Centre, KNUST

 Responsibilities and positions held:

-Lecturer in Materials Engineering, Production and Industrial Engineering as well as Small Hydropower

-Programme Coordinator, MSc Renewable Energy Technologies via e-Learning (Played a key role   in the development of the programme)

-Institutional Coordinator, International Network on Energy & Environmental Sustainability (INEES)

-Assistant Coordinator Renewable Energy Education Project (REEP), 2008-2011, sponsored by Edulink ACP-EU cooperation project in higher education.

-Academic Board Representative (Ho Polytechnic)

- College Board Representative, Department of Mechanical Engineering 2010

PUBLICATIONS:         

(1) E.H. Amalu, N.N. Ekere, R.S. Bhatti, S. Mallik, G.Takyi and A.O.A Ibhadode. (2010) “Numerical Investigation of Thermo-Mechanical Behaviour Of Ball Grid Array At High Temperature Application”, Presented at the International Conference on Engineering Research and Development (ICERD), University of Benin, Benin City, Nigeria, 7th -9th, pp.1242-1251. 

(2)        E.H, Amalu, Y.T, Lui, N.N, Ekere, R.S, Bhatti, G, Takyi, (2010). “Investigation of the Effects of Reflow Profile Parameters on Lead-free Solder Bump Volumes and Joint Integrity, Presented at AMPT Conference, Paris 24-27, Book of Abstract pp 201. 1315.

(3)        G. Takyi, N.N Ekere. (2010), “Study of the Effects of PCB Surface Finish on Plasma Process Time for Lead-Free Wave Soldering”, Published in the Journal of Soldering & Surface Mount, issue 2, vol.22, pp 37-42.

(4)        G.Takyi, N.N Ekere. (2010). “Investigation of the Effects of Air Atmosphere on Solder Wettability of Plasma Treated HASL Finish PCBs”, Published in the Journal of Soldering & Surface Mount, issue 3, vol.22.

(5)        G.Takyi, E.H Amalu, P. Bernasko. (2011). “Effect of Solder Joint Integrity on Thermal Performance of Thermo-Electric Cooler for 980 nm Pump Laser Module”, published in issue 2, vol. 23, pp. 115-119, Journal of Soldering and Surface Mount.

(6)        P.K Bernasco, S.Mallik, N.N Ekere, A. Seaman, G. Takyi. (2009). “Effect of Ageing Temperatures and Reflow Profiles on the Intermetallic growth between Sn-Ag-Cu solder alloy and Cu”, Published in IEEE EPTC, 11th Electronic Packaging Conference, Singapore, pp 986-990.  

(7)        G.Takyi, C. Beesley, R. Baittig, (2007).“Characterisation of 980nm Pump Laser Solder Joint Integrity Using Heat Pump Tests”, Published in IEEE/CPMT, 32nd IEMT Conference Proceedings, San Jose, USA, 3rd-5th October 2007, pp. 234-238.

(8)        G. Takyi, N.N Ekere, K.G Snowdon, C.K Tannar, (1999).“Evaluation of HASL Finish PCBs using DCA measurements”, International Journal of Electronic Manufacturing (JEM), vol.9, no. 3, pp 233-239.

(9)        G. Takyi, N.N Ekere, K.G Snowdon, S.G Tannar, (1998).“Solderability Testing in Nitrogen Atmosphere of Plasma Treated HASL Finish PCBs for Fluxless Soldering”, IEMT/CPMT Conference, Austin Texas, USA, pp 172-189.

(10) G. Takyi, C, A. Boahen, (2015). Prefeasibility Studies for Mini-hydropower Generation on Kintampo Falls, Under Review at African Journal of Science, Technology, Innovation and Development (AJSTID)

(11) G. Takyi, C.A, Brohen, (2014). Prefeasibility Studies for Mini-hydropower Generation on Kintampo Falls, College of Engineering Research Retreat (CERR), August 2014.

(12) G. Takyi, K. Akosa, (2014). Renewable Energy Project as a Tool for Alleviating Energy Poverty, College of Engineering Research Retreat (CERR) August, 2014.

(11)      E.H Amalu, W.K Lau, N.N Ekere, R.S Bhatti, S. Mallik, K.C Otiabia, G. Takyi, (2011). A study of Sn-Ag-Cu solder paste transfer efficiency and effects of optimal reflow profile on solder deposits, Journal of Micro-electronics Engineering, ELSEVIER, 88, pp. 1610-1617.

(12)      E.H Amalu, N.N Ekere, R.S Bhatti, S. Mallik, G. Takyi, (2012). Numerical investigation of thermo-mechanical behavior of ball grid array solder joint at high temperature excursion, Journal of Advanced Materials Research Trans-tech publications, Switzerland, vol. 367, pp. 287-292.

(13)      P. K. Bernasko, S. Mallik, G. Takyi, (2014). Effect of reflow profile parameters on surface mount chip resistor solder joint shear strength, International Journal of Material Science and Applications, iss. 3 vol. 5, pp. 245-259.

(14)      G. Takyi, P.K Bernasko, E.H Amalu, (2015). Investigation of wettability of lead free-solder on bare copper and organic solder preservatives surface finishes, published in International Journal of Material Science & Applications, vol. 4, iss. 3, pp 165-172.

(15)      G. Takyi, P.K. Bernasko, (2014). The effects of reflow profile parameters on Sn-Ag-Cu solder bumps and Cu substrate using full factorial design, Journal of Surface Mount Technology (SMTA), vol. 27, iss.4, pp 13-22.

(16)      P. K Bernasko, S. Mallik, and G.Takyi, (2015), Effect of intermetallic compound layer thickness on the shear strength of 1206 chip resistor solder joint, Soldering & Surface Mount Technology (SSMT), vol. 27, iss.1, pp.52-58.

 (17) G. Takyi, P.k Bernasko, (2015), Optimisation of Reflow Profile of Surface Mounts Assembly Using Taguchi Design of experiments, International Journal of Material Science and Applications, vol. 4, iss. 3, pp 150-169.

(18) S. Mallik, J. Njoku, G. Takyi, (2015), Quantitative evaluation of voids in lead free solder joints, Journal of Applied Mechanics and Materials Vol. 772, pp 284-289.

(19)      P.K Bernasko, S, Mallik, N.N Ekere, G. Takyi, (2011). Evaluating the effect of pad sizes on the intermetallic layer formation and growth for Sn-Ag-Cu solders on Cu metallization, International Conference on electronics packaging, Japan.

(20)      S. Mallik, J. Njoku, G. Takyi, (2014). Quantitative evaluation of voids in lead free solder joints, International Conference on Mechanical Properties of Materials (ICMPM), Barcelona, Spain.

(21) G. Takyi, C.A, Brohen, (2014). Prefeasibility Studies for Mini-hydropower Generation on Kintampo Falls, CERR August.

(22) G. Takyi, K. Akosa, (2014). Renewable Energy Project as a Tool for Alleviating Energy Poverty, CERR August.